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AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
7
Incremental Quadrature AB Output
The digital output is compatible to optical incremental
S
N
S
N
S
encoder outputs. Direction of rotation is encoded into
two signals A and B that are phase-shifted by 90o.
Depending on the direction of rotation, A leads B
(CW) or B leads A (CCW).
7.1.1
Index Pulse
A
40
1
2
40
1
2
A single index pulse is generated once for every pole
pair. One pole pair is interpolated to 40 quadrature
pulses (160 steps), so one index pulse is generated
B
40
1
2
40
1
2
The Index output is switched to Index = high, when a
magnet is placed over the Hall array as shown in
placed over the left side of the IC (top view, pin#1 at
bottom left) and the south pole is placed over the
right side of the IC.
The index output will switch back to Index = low,
when the magnet is moved by one LSB from position
X=0 to X=X1, as shown in Figure 7, bottom graph.
One LSB is 25μm for AS5304 and 15μm for AS5306.
Index
Detail:
A
B
Index
Note: Since the small step size of 1 LSB is hardly
recognizable in a correctly scaled graph it is shown as an
Step #
157 158 159
0
1
2
3
4
5
Figure 6:
Quadrature A / B and Index output
7.1.2
Magnetic Field Warning Indicator
The AS5304 can also provide a low magnetic field warning to indicate a missing magnet or when the end of the magnetic strip
has been reached. This condition is indicated by using a combination of A, B and Index, that does not occur in normal
operation:
A low magnetic field is indicated with:
Index = high
A=B=low
7.1.3
Vertical Distance between Magnet and IC
The recommended vertical distance between magnet and IC depends on the strength of the magnet and the length of the
magnetic pole.
Typically, the vertical distance between magnet and chip surface should not exceed ? of the pole length.
That means for AS5304, having a pole length of 2.0mm, the maximum vertical gap should be 1.0mm,
For the AS5306, having a pole length of 1.2mm, the maximum vertical gap should be 0.6mm
These figures refer to the chip surface. Given a typical distance of 0.2mm between chip surface and IC package surface,
the recommended vertical distances between magnet and IC surface are therefore:
AS 5304: ≤ 0.8mm
AS 5306: ≤ 0.4mm
Revision 1.9
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